Electronic Board Assembly & Manufacturing


Electronic Board Assembly and Manufacturing Services



Our source for electronic board assembly and box build services is a flexible, responsive and reliable source offering the highest quality product at a competitive price. Their entire operation for Arizona manufacturing sales is built around the highest possible deliverable quality (99.9%) scaled from prototype to full production runs of multiple thousand electronic boards. Their ability to accomplish complete box builds, supplying all needed components or utilizing client supplied parts, allows a full turnkey operation for companies in need of a full service operation.

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Capabilities


Electronic Board Assembly Equipment List

 

Electronic Board Materials/Substrates
  • Rigid
  • Rigid-Flex
  • Full Flex
  • Standard FR4
  • Copper and Aluminum clad
SMT Placement
  • High Speed SMT
  • Discrete to 0201
  • Pitches to .03mm
  • BGA,LGA,QFN,POP,CSP
  • Space/Trace to .0025
  • Through Hole
    • Selective Solder
    • Press Fit to 20 tons
    • Custom Press tooling
Manufacturing Cleanliness
  • Ionic Levels
  • In-house ROSE Equipment
  • RF/Hi-Rel Capability
  • Closed-Loop Aqueous
  • MIL/J-STD/IPC Reporting
Quality Assurance for Electronic Board Assemblies
  • Certifications
    • AS9100
    • ITAR
  • On-site training
    • IPC-A-610
    • J-STD-001
  • Quality programs
    • New Production Introduction – NPI
    • Design for Manufacturing – DFM
    • Stencil Aperture Optimization
    • Supplier Quality Management Program – SQMP
    • Statistical Process Control – SPC
    • 100% Final Quality Inspection
    • First Article Inspection (F/A)
    • Risk Assessments
    • Key Process Indicators
    • Continual Improvement
  • Equipment
    • 3D Solder Joint Inspection with 1 micron accuracy
    • X-Ray
      • 200X magnification
      • Void Measurement
      • BGA Analysis
Support - Added Value
  • Automated MRP/ERP
  • Component Traceability
  • RoHS Conversion Services
  • Obsolete Assistance
  • Inventory Management
  • Life-Cycle/Risk Analysis
  • BOM Cost Analysis and Reduction
  • Bonded Inventory Options
Additional Manufacturing Operations
  • Electro-mechanical box build
    • One line item purchasing
    • Tested to client specifications
    • Complete assembly, branding and packaging
  • Cable Services
    • Custom Cable Assemblies
    • Wire Harnesses
    • Over molding/Encapsulation
    • Continuity testing
  • Testing
    • Functional
    • JTAG/Boundary Scan
    • Flying probe
    • Burn-in
    • Hi-pot
  • Conformal Coatings
    • Acrylic
    • Silicone
    • Urethane
    • Bonding
    • Parylene-C
    • Potting
    • Encapsulation
    • Under fills
Software and Specifications Needed For Quoting and Production
  • Gerber File
  • BOM